Date | Schedule | Language |
8:00-18:00, August 21 8:00-22:00, August 22 | Registration | |
Afternoon, August 21 | International Short Course on MOCVD Technology I | Consecutive Interpretation |
Morning, August 22 | International Short Course on MOCVD Technology II |
Afternoon, August 22 | 2nd New Technologies, Equipment, Products & Materials Release | Chinese and English (Simultaneous Interpretation) |
Evening, August 22 | Reception Banquet | |
Morning, August 23 | Opening Ceremony and Plenary | Chinese and English (Simultaneous Interpretation) |
Afternoon, August 23 | Epitaxy & Chip Session I | English |
Packaging & Module Session I | Chinese and English (Simultaneous Interpretation) |
Application Session I |
Standards & Equipment Session I |
Morning, August 24 | Epitaxy & Chip Session II | English |
Packaging & Module Session II | Chinese and English (Simultaneous Interpretation) |
Application Session II |
Standards & Equipment Session II |
Afternoon, August 24 | Panel discussion on Cooperation & Competition between China and Foreign Companies | Chinese and English (Simultaneous Interpretation) |
Closing Ceremony |
Evening, August 24 | Closing Banquet | |